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IRF640

Specifications

SKU: 12510528

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Parameter Symbol Min Typical Max Unit
Drain-Source Voltage VDS -55 - 200 V
Gate-Source Voltage VGS -15 - 20 V
Continuous Drain Current ID - 16 - A
Pulse Drain Current IDpeak - 75 - A
Power Dissipation Ptot - - 130 W
Junction Temperature TJ - - 150 °C
Storage Temperature Tstg -55 - 150 °C

Instructions for Use:

  1. Voltage Ratings:

    • Ensure that the drain-source voltage (VDS) does not exceed 200V to prevent breakdown.
    • The gate-source voltage (VGS) should be kept within -15V to +20V to avoid damaging the gate oxide.
  2. Current Ratings:

    • The continuous drain current (ID) should not exceed 16A to prevent overheating.
    • For pulse applications, the peak drain current (IDpeak) can go up to 75A, but ensure proper heat dissipation.
  3. Power Dissipation:

    • The total power dissipation (Ptot) should not exceed 130W. Use appropriate heatsinking to manage thermal conditions.
  4. Temperature Limits:

    • The junction temperature (TJ) must not exceed 150°C to maintain reliable operation.
    • Store the device in an environment where the temperature ranges from -55°C to 150°C.
  5. Handling Precautions:

    • Handle the device with care to avoid static discharge, which can damage the gate.
    • Use proper mounting techniques to ensure good thermal contact with the heatsink.
  6. Application Notes:

    • The IRF640 is suitable for high-frequency switching applications, motor control, and power supplies.
    • Refer to the datasheet for detailed application circuits and recommended operating conditions.
(For reference only)

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