Specifications
SKU: 12510528
Parameter | Symbol | Min | Typical | Max | Unit |
---|---|---|---|---|---|
Drain-Source Voltage | VDS | -55 | - | 200 | V |
Gate-Source Voltage | VGS | -15 | - | 20 | V |
Continuous Drain Current | ID | - | 16 | - | A |
Pulse Drain Current | IDpeak | - | 75 | - | A |
Power Dissipation | Ptot | - | - | 130 | W |
Junction Temperature | TJ | - | - | 150 | °C |
Storage Temperature | Tstg | -55 | - | 150 | °C |
Instructions for Use:
Voltage Ratings:
- Ensure that the drain-source voltage (VDS) does not exceed 200V to prevent breakdown.
- The gate-source voltage (VGS) should be kept within -15V to +20V to avoid damaging the gate oxide.
Current Ratings:
- The continuous drain current (ID) should not exceed 16A to prevent overheating.
- For pulse applications, the peak drain current (IDpeak) can go up to 75A, but ensure proper heat dissipation.
Power Dissipation:
- The total power dissipation (Ptot) should not exceed 130W. Use appropriate heatsinking to manage thermal conditions.
Temperature Limits:
- The junction temperature (TJ) must not exceed 150°C to maintain reliable operation.
- Store the device in an environment where the temperature ranges from -55°C to 150°C.
Handling Precautions:
- Handle the device with care to avoid static discharge, which can damage the gate.
- Use proper mounting techniques to ensure good thermal contact with the heatsink.
Application Notes:
- The IRF640 is suitable for high-frequency switching applications, motor control, and power supplies.
- Refer to the datasheet for detailed application circuits and recommended operating conditions.
Inquiry - IRF640