Instructions for Use:

1. Mounting:

   • Ensure proper heat sinking to maintain junction temperature within specified limits.
   • Use recommended mounting torque for screws to avoid damage.

2. Gate Drive:

   • Apply gate trigger current (I_GT) and voltage (V_GT) as specified to ensure reliable turn-on.
   • Avoid exceeding the maximum gate trigger voltage and current to prevent damage.

3. Surge Handling:

   • The device can handle non-repetitive peak surge currents up to 2400 A for 8.3 ms, but repetitive surges should not exceed 1500 A at the same duration.
   • Ensure adequate derating for repetitive surge conditions to avoid premature failure.

4. Thermal Management:

   • Monitor the junction temperature (T_j) to ensure it does not exceed 125°C under continuous operation.
   • Use appropriate cooling methods such as forced air or liquid cooling if necessary.

5. Storage:

   • Store the device in a dry environment with temperatures between -55°C and 150°C.
   • Avoid exposure to excessive humidity and corrosive environments.

6. Electrical Isolation:

   • Ensure proper electrical isolation to prevent short circuits and ensure safe operation.
   • Use appropriate insulation materials and techniques.

7. Handling:

   • Handle the device with care to avoid mechanical damage.
   • Use ESD (Electrostatic Discharge) protection when handling to prevent damage from static electricity.

8. Testing:

   • Perform regular testing to ensure the device is functioning within specified parameters.
   • Use calibrated test equipment to ensure accurate measurements.