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DM74F573PC

Specifications

SKU: 12532923

BUY DM74F573PC https://www.utsource.net/itm/p/12532923.html

Parameter Symbol Min Typ Max Unit
Supply Voltage Vcc 4.75 5 5.25 V
Input Low Voltage VIL 0 0.8 - V
Input High Voltage VIH 2 3.5 - V
Output Low Voltage (IOL=4mA) VOL 0 0.4 0.6 V
Output High Voltage (IOH=-4mA) VOH 2.4 3.5 5.25 V
Propagation Delay Time (Typical) tpd - 15 - ns
Power Dissipation PD - - 100 mW
Operating Temperature Topr -40 - 85 °C
Storage Temperature Tstg -65 - 150 °C

Instructions for Use:

  1. Power Supply:

    • Ensure the supply voltage (Vcc) is within the specified range of 4.75V to 5.25V.
    • Use a stable power source to avoid voltage fluctuations that can affect the performance of the device.
  2. Input Signals:

    • For a valid low input, the voltage should be between 0V and 0.8V.
    • For a valid high input, the voltage should be between 2V and 3.5V.
  3. Output Signals:

    • When the output is low, the voltage will be between 0V and 0.6V.
    • When the output is high, the voltage will be between 2.4V and 5.25V.
  4. Propagation Delay:

    • The typical propagation delay time (tpd) is 15 nanoseconds. This is the time it takes for the output to respond to a change in the input signal.
  5. Power Dissipation:

    • The maximum power dissipation is 100 milliwatts. Ensure that the device is not operated beyond this limit to prevent overheating and potential damage.
  6. Temperature Ranges:

    • The operating temperature range is from -40°C to 85°C.
    • The storage temperature range is from -65°C to 150°C. Store the device in a cool, dry place when not in use.
  7. Handling:

    • Handle the device with care to avoid static discharge, which can damage the internal components.
    • Use proper anti-static precautions when handling or soldering the device.
  8. Mounting:

    • Ensure that the device is properly mounted on the PCB with correct orientation and soldering.
    • Follow the recommended PCB layout guidelines to ensure optimal performance and reliability.
  9. Testing:

    • Before final assembly, test the device to ensure it meets the specified parameters.
    • Use appropriate test equipment and procedures to verify functionality.
  10. Documentation:

    • Refer to the datasheet and application notes for detailed information and specific use cases.
    • Keep the documentation accessible for future reference and troubleshooting.
(For reference only)

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