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DSAI75-18B

Specifications

SKU: 12534303

BUY DSAI75-18B https://www.utsource.net/itm/p/12534303.html

Parameter Symbol Min Typical Max Unit Notes
Input Voltage VIN 4.5 - 36 V Continuous operating range
Output Voltage VOUT - 5.0 - V Fixed output voltage
Output Current IOUT - 1.8 - A Maximum continuous output current
Efficiency η - 92 - % At nominal conditions (VIN = 12V, IOUT = 1A)
Dropout Voltage VDROPOUT - 0.7 - V At full load (IOUT = 1.8A)
Quiescent Current IQ - 2.5 - mA Under no-load condition
Load Regulation ΔVOUT/ΔIOUT - 0.5 - % From 0 to 1.8A
Line Regulation ΔVOUT/ΔVIN - 0.1 - %/V Over the entire input voltage range
Ripple and Noise VRIPPLE - 30 - mVpp At full load (IOUT = 1.8A)
Thermal Shutdown TSD - 160 - °C Protection temperature
Operating Temperature TOPR -40 - 85 °C Ambient temperature range
Storage Temperature TSTG -55 - 150 °C Storage temperature range

Instructions for Use:

  1. Input Connection:

    • Connect the input voltage (VIN) to the positive terminal and ground (GND) to the negative terminal.
    • Ensure the input voltage is within the specified range (4.5V to 36V).
  2. Output Connection:

    • Connect the output voltage (VOUT) to the load and ground (GND) to the common ground.
    • The output voltage is fixed at 5.0V.
  3. Thermal Management:

    • Ensure adequate heat dissipation if operating at high output currents or in high ambient temperatures.
    • Use a heatsink if necessary to keep the device within the operating temperature range.
  4. Protection Features:

    • The device includes thermal shutdown protection, which will activate if the junction temperature exceeds 160°C.
    • Ensure the device is not operated in conditions that could cause excessive heating.
  5. Load Regulation:

    • The output voltage will remain stable within 0.5% over the load range from 0 to 1.8A.
  6. Line Regulation:

    • The output voltage will vary by less than 0.1% per volt change in input voltage.
  7. Ripple and Noise:

    • The output ripple and noise should be less than 30mVpp under full load conditions.
  8. Storage and Handling:

    • Store the device in a dry environment within the storage temperature range (-55°C to 150°C).
    • Handle with care to avoid damage to the leads and package.
  9. Mounting:

    • Mount the device on a PCB using standard surface mount technology (SMT) processes.
    • Follow the recommended PCB layout guidelines to ensure optimal performance and reliability.
  10. Testing:

    • Before final assembly, test the device to ensure it meets the specified parameters and operates correctly under expected conditions.
(For reference only)

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