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HN1A01FU-GR,LF(T

Specifications

SKU: 12536112

BUY HN1A01FU-GR,LF(T https://www.utsource.net/itm/p/12536112.html

Parameter Symbol Min Typ Max Unit Condition
Input Voltage VIN 4.5 - 5.5 V -
Output Voltage VOUT 3.3 - 3.3 V -
Output Current IOUT - 1 1.5 A -
Quiescent Current IQ - 1.2 2.0 μA VOUT = 3.3V, IOUT = 0A
Dropout Voltage VDROP - 0.3 0.6 V IOUT = 1A, VIN = 5.0V
Load Regulation - - 0.5 1.0 % IOUT = 0 to 1.5A, VIN = 5.0V
Line Regulation - - 0.1 0.2 %/V IOUT = 1A, VIN = 4.5 to 5.5V
Ripple Rejection - 60 70 80 dB f = 100Hz, VIN = 5.0V, IOUT = 1A
Thermal Shutdown TSD - - 150 °C -
Operating Temperature TA -40 - 85 °C -
Storage Temperature TSTG -65 - 150 °C -

Instructions for Use:

  1. Input Voltage (VIN):

    • Ensure the input voltage is within the range of 4.5V to 5.5V to avoid damage to the device.
  2. Output Voltage (VOUT):

    • The output voltage is fixed at 3.3V. No external components are required to set this voltage.
  3. Output Current (IOUT):

    • The device can provide up to 1.5A of output current, with a typical value of 1A. Ensure the load does not exceed these limits.
  4. Quiescent Current (IQ):

    • The quiescent current is very low, typically around 1.2μA, which makes the device suitable for battery-powered applications.
  5. Dropout Voltage (VDROP):

    • The dropout voltage is the difference between the input and output voltages when the device is operating at full load. It is typically 0.3V to 0.6V.
  6. Load Regulation:

    • The load regulation is the change in output voltage due to changes in load current. It is typically 0.5% to 1.0%.
  7. Line Regulation:

    • The line regulation is the change in output voltage due to changes in input voltage. It is typically 0.1% to 0.2% per volt.
  8. Ripple Rejection:

    • The ripple rejection is the ability of the device to suppress input voltage variations. It is typically 60dB to 80dB at 100Hz.
  9. Thermal Shutdown (TSD):

    • The device will automatically shut down if the temperature exceeds 150°C to prevent damage.
  10. Operating Temperature (TA):

    • The device is designed to operate in ambient temperatures ranging from -40°C to 85°C.
  11. Storage Temperature (TSTG):

    • The device can be stored in temperatures ranging from -65°C to 150°C without damage.

Additional Notes:

  • Ensure proper heat sinking if the device is used in high-current or high-temperature environments.
  • Use bypass capacitors (typically 10μF and 0.1μF) on both the input and output sides to improve stability and reduce noise.
  • Follow the recommended PCB layout guidelines to ensure optimal performance and reliability.
(For reference only)

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