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BTS728L2

Specifications

SKU: 12541691

BUY BTS728L2 https://www.utsource.net/itm/p/12541691.html

Parameter Symbol Min Typ Max Unit Notes
Supply Voltage VIN 4.5 - 30 V -
Continuous Output Current IOUT - 10 16 A -
Peak Output Current IOUT(peak) - - 24 A -
Thermal Shutdown Temperature TSD - 160 180 °C -
Operating Temperature TA -40 - 125 °C -
Storage Temperature TSTG -40 - 150 °C -
Junction-to-Ambient Thermal Resistance RθJA - 35 - K/W -
Control Input Voltage (High) VIN(High) 4.5 - 30 V -
Control Input Voltage (Low) VIN(Low) 0 - 0.4 V -
Quiescent Current IQ - 1.5 2.5 mA -
Short-Circuit Protection - - - - - Active
Overtemperature Protection - - - - - Active

Instructions for Use:

  1. Supply Voltage (VIN):

    • Ensure the supply voltage is within the range of 4.5V to 30V.
    • Exceeding this range can damage the device.
  2. Continuous Output Current (IOUT):

    • The device can handle a continuous current of up to 10A, with a peak current of up to 16A.
    • For applications requiring higher currents, ensure adequate heat dissipation.
  3. Thermal Management:

    • Monitor the junction temperature to avoid exceeding 160°C, which can trigger thermal shutdown.
    • Use a heatsink or other cooling methods if necessary.
  4. Control Input:

    • Apply a high control input voltage (4.5V to 30V) to turn on the output.
    • Apply a low control input voltage (0V to 0.4V) to turn off the output.
  5. Protection Features:

    • The device includes short-circuit and overtemperature protection.
    • These features will automatically shut down the device to prevent damage.
  6. Operating and Storage Temperatures:

    • Operate the device within the temperature range of -40°C to 125°C.
    • Store the device within the temperature range of -40°C to 150°C.
  7. Quiescent Current:

    • The quiescent current is typically 1.5mA and should not exceed 2.5mA.
  8. Mounting and Handling:

    • Follow standard handling procedures to avoid static damage.
    • Ensure proper mounting to the PCB to maintain electrical and thermal performance.
  9. Testing:

    • Before deploying the device in a final application, test it under typical operating conditions to ensure reliability.

For detailed specifications and additional information, refer to the datasheet provided by the manufacturer.

(For reference only)

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