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2SC4793

Specifications

SKU: 12591451

BUY 2SC4793 https://www.utsource.net/itm/p/12591451.html

Parameter Symbol Min Typ Max Unit
Collector-Emitter Voltage VCEO - - 800 V
Collector-Base Voltage VCBO - - 800 V
Emitter-Base Voltage VEBO - - 10 V
Collector Current IC - 15 - A
Base Current IB - - 2 A
Power Dissipation PT - - 125 W
Junction Temperature TJ -20 - 150 °C
Storage Temperature TSTG -65 - 150 °C
Transition Frequency fT - 30 - MHz
DC Current Gain hFE 20 100 - -

Instructions for Use:

  1. Mounting and Handling:

    • Ensure that the device is handled with care to avoid mechanical damage.
    • Use appropriate heat sinks to manage thermal dissipation, especially when operating at high power levels.
  2. Electrical Connections:

    • Connect the collector (C), base (B), and emitter (E) terminals correctly to avoid damage.
    • Ensure that the maximum ratings for voltage and current are not exceeded.
  3. Thermal Management:

    • The junction temperature should be kept within the specified range to ensure reliable operation.
    • Use thermal grease or thermal pads between the transistor and the heat sink for better heat transfer.
  4. Storage and Operating Conditions:

    • Store the device in a dry environment within the specified storage temperature range.
    • Operate the device within the specified junction temperature range to prevent thermal runaway.
  5. Testing:

    • Before installing the device in a circuit, test it using a transistor tester or multimeter to ensure it meets the specified parameters.
    • During testing, apply voltages and currents gradually to avoid sudden stress on the device.
  6. Circuit Design:

    • Design the circuit to include necessary protection components such as diodes for reverse voltage protection and resistors for current limiting.
    • Consider the transient and steady-state conditions of the circuit to ensure the device operates within its safe operating area (SOA).
  7. Environmental Considerations:

    • The device should be used in environments where it is protected from moisture, dust, and other contaminants that could affect its performance.
    • Ensure that the device is not exposed to corrosive gases or chemicals.
(For reference only)

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