Specifications
SKU: 12591477
Parameter | Symbol | Min | Typ | Max | Unit |
---|---|---|---|---|---|
Forward Voltage | V_F | - | 1.8 | 2.2 | V |
Reverse Current | I_R | - | 1 | 10 | μA |
Continuous Forward Current | I_F | - | 30 | 50 | mA |
Peak Forward Current | I_FM | - | - | 100 | mA |
Thermal Resistance | R_th | - | 150 | - | K/W |
Operating Temperature | T_op | -40 | - | 85 | °C |
Storage Temperature | T_stg | -40 | - | 100 | °C |
Instructions for Use:
- Forward Voltage (V_F): Ensure that the forward voltage applied to the BSN254 does not exceed 2.2V to avoid damaging the component.
- Reverse Current (I_R): The reverse current should be kept below 10μA to prevent excessive leakage and potential damage.
- Continuous Forward Current (I_F): The continuous forward current should not exceed 50mA. For optimal performance, it is recommended to stay below 30mA.
- Peak Forward Current (I_FM): The peak forward current should not exceed 100mA. This value should only be reached for short durations.
- Thermal Resistance (R_th): The thermal resistance of the BSN254 is 150 K/W. Ensure proper heat dissipation to maintain the operating temperature within safe limits.
- Operating Temperature (T_op): The operating temperature range is from -40°C to 85°C. Avoid operating the component outside this range to prevent failure.
- Storage Temperature (T_stg): Store the BSN254 in an environment with temperatures ranging from -40°C to 100°C to ensure long-term reliability.
Handling and Storage:
- ESD Protection: The BSN254 is sensitive to electrostatic discharge (ESD). Handle the component with ESD-protected equipment and follow standard ESD handling procedures.
- Moisture Sensitivity: Keep the component in a dry environment to prevent moisture-related issues. Follow the recommended storage conditions to minimize exposure to humidity.
- Mounting: Use appropriate soldering techniques and ensure that the component is securely mounted on the PCB. Avoid excessive mechanical stress during assembly.
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