Instructions:

1. Power Supply Connection:

   • Connect the input voltage to the designated VIN pin.
   • Ensure the input voltage is within the specified range (3.3 to 5.5V).
   • Connect the ground (GND) pin to the system ground.

2. Output Load Connection:

   • Connect the load to the VOUT pin.
   • Ensure the load current does not exceed the maximum continuous output current (2.0A).

3. Thermal Management:

   • Place the device on a PCB with adequate thermal vias to dissipate heat.
   • Avoid operating the device in environments exceeding the maximum operating temperature (+85°C).

4. EMI Considerations:

   • The device includes an integrated EMI filter to minimize electromagnetic interference.
   • Use proper PCB layout techniques to further reduce EMI, such as short traces and ground planes.

5. Protection:

   • The device has built-in overcurrent, overvoltage, and thermal protection.
   • In case of a fault, the device will automatically shut down to prevent damage.

6. Storage:

   • Store the device in a dry environment with relative humidity between 0% and 95% (non-condensing).
   • Avoid exposing the device to temperatures outside the storage temperature range (-55 to +125°C).

7. Handling:

   • Handle the device with care to avoid mechanical stress or damage.
   • Follow standard ESD (Electrostatic Discharge) precautions when handling the device.