Instructions for Use:

1. Mounting:

   • Place the component on the PCB using standard SMT placement equipment.
   • Ensure that the component is aligned correctly with the pads.

2. Soldering:

   • Use a reflow soldering process with a peak temperature of 260°C.
   • Avoid overheating as it can damage the component.
   • Ensure good solder joints to maintain electrical performance and mechanical stability.

3. Handling:

   • Handle the component with care to avoid mechanical stress or damage.
   • Store in a dry environment to prevent moisture absorption.

4. Testing:

   • Measure the inductance and DC resistance using a suitable LCR meter.
   • Verify that the inductance is within the specified tolerance range.
   • Check the saturation current by applying the rated current and measuring the inductance drop.

5. Design Considerations:

   • Ensure adequate clearance around the component to allow for heat dissipation.
   • Consider the operating temperature range and environmental conditions when designing the circuit.
   • Use the component in applications where a compact, high-performance inductor is required, such as power supplies, filters, and signal conditioning circuits.