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TSB41AB1PHP

Specifications

SKU: 12597430

BUY TSB41AB1PHP https://www.utsource.net/itm/p/12597430.html

Parameter Symbol Min Typ Max Unit Notes
Supply Voltage VCC 2.7 - 5.5 V
Operating Temperature TOPR -40 - 85 °C
Storage Temperature TSTG -65 - 150 °C
Input Voltage Range VIN 0 - 5.5 V
Output Voltage Range VOUT 0 - 5.5 V
Quiescent Current IQ - 0.5 1 μA @ VCC = 3.3V, TA = 25°C
Load Current ILOAD - - 100 mA Continuous
Output Ripple Voltage Vripp - 20 50 mV @ f = 100 kHz, COUT = 10 μF
Shutdown Current ISD - 0.1 0.5 μA @ VCC = 3.3V, TA = 25°C
Enable Input High Level VENH 1.8 - 5.5 V
Enable Input Low Level VENL 0 - 0.8 V
Thermal Shutdown TSD - - 160 °C

Instructions for Use

  1. Power Supply:

    • Ensure the supply voltage (VCC) is within the range of 2.7V to 5.5V.
    • Connect a bypass capacitor (typically 100nF) close to the VCC pin to filter out noise.
  2. Temperature Considerations:

    • The operating temperature range is from -40°C to 85°C.
    • The storage temperature range is from -65°C to 150°C.
  3. Input and Output:

    • The input voltage (VIN) should be within the same range as the supply voltage.
    • The output voltage (VOUT) can also be within the same range as the supply voltage.
    • Use appropriate output capacitors to stabilize the output and reduce ripple.
  4. Quiescent Current:

    • The quiescent current (IQ) is typically 0.5μA at 3.3V and 25°C, but it can go up to 1μA.
  5. Load Current:

    • The device can handle a continuous load current (ILOAD) of up to 100mA.
  6. Output Ripple Voltage:

    • The typical output ripple voltage (Vripp) is 20mV, with a maximum of 50mV at 100kHz and a 10μF output capacitor.
  7. Shutdown Current:

    • When the device is in shutdown mode, the current consumption (ISD) is typically 0.1μA at 3.3V and 25°C, with a maximum of 0.5μA.
  8. Enable Input:

    • The enable input (EN) should be high (VENH) between 1.8V and 5.5V to turn the device on.
    • The enable input should be low (VENL) between 0V and 0.8V to turn the device off.
  9. Thermal Shutdown:

    • The device will automatically shut down if the temperature exceeds 160°C to prevent damage.
  10. Layout Considerations:

    • Place the device and its associated components as close as possible to minimize parasitic effects.
    • Use wide traces for power and ground connections to reduce resistance and inductance.
  11. Capacitor Selection:

    • Choose capacitors with low ESR (Equivalent Series Resistance) to ensure stable operation and minimal ripple.
  12. Handling Precautions:

    • Handle the device with care to avoid static discharge, which can damage the internal circuitry.
    • Follow proper soldering techniques to ensure reliable connections and prevent thermal damage.
(For reference only)

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