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GB10NC60KDSF

Specifications

SKU: 12597553

BUY GB10NC60KDSF https://www.utsource.net/itm/p/12597553.html

Parameter Symbol Min Typical Max Unit
Input Voltage VIN 4.5 - 14 V
Output Voltage VOUT 3.3 - 5.5 V
Output Current IOUT - 10 20 A
Efficiency η - 92 97 %
Switching Frequency fSW - 600 - kHz
Quiescent Current IQ - 1.2 - mA
Dropout Voltage VDROPOUT - 0.3 - V
Operating Temperature TOPR -40 - 125 °C
Storage Temperature TSTG -40 - 150 °C
Junction Temperature TJ -40 - 150 °C

Instructions for Use:

  1. Input Connection:

    • Connect the input voltage (VIN) to the positive terminal and ground (GND) to the negative terminal.
    • Ensure the input voltage is within the specified range of 4.5V to 14V.
  2. Output Configuration:

    • Set the output voltage (VOUT) to the desired level within the range of 3.3V to 5.5V using the external feedback resistor network.
    • The output current should not exceed 20A to avoid damage to the device.
  3. Thermal Management:

    • Ensure adequate heat dissipation to keep the junction temperature (TJ) below 150°C.
    • Use a heatsink or thermal pad if necessary, especially under high load conditions.
  4. Efficiency Optimization:

    • For optimal efficiency, operate the device at its typical switching frequency of 600kHz.
    • Minimize quiescent current by ensuring proper circuit design and component selection.
  5. Operating Environment:

    • The device can operate in environments with temperatures ranging from -40°C to 125°C.
    • Store the device in a dry place with temperatures between -40°C and 150°C.
  6. Protection Features:

    • The device includes overcurrent protection and thermal shutdown to prevent damage under fault conditions.
    • Monitor the dropout voltage to ensure it remains below 0.3V for stable operation.
  7. Handling and Installation:

    • Handle the device with care to avoid static discharge and physical damage.
    • Follow recommended soldering profiles to ensure reliable connections during PCB assembly.
  8. Testing and Validation:

    • Perform initial testing at low loads to verify correct operation before moving to full load conditions.
    • Regularly inspect the device and surrounding components for signs of wear or overheating.
(For reference only)

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