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1SS294

Specifications

SKU: 12603229

BUY 1SS294 https://www.utsource.net/itm/p/12603229.html

Parameter Symbol Min Typical Max Unit
Collector-Emitter Voltage VCE - - 30 V
Emitter-Base Voltage VEB -5 - 5 V
Collector Current IC - - 5 mA
Base Current IB - - 1 mA
DC Current Gain hFE 100 300 800 -
Transition Frequency fT - 800 - MHz
Storage Temperature Range TSTG -55 - 150 °C
Operating Temperature Range TA -55 - 150 °C

Instructions for Using 1SS294:

  1. Mounting:

    • Ensure the device is mounted on a suitable heat sink if operating at high currents.
    • Use appropriate mounting hardware to secure the transistor without excessive force.
  2. Biasing:

    • Set the base current (IB) to ensure the transistor operates within its safe operating area (SOA).
    • For linear applications, bias the transistor in the active region to avoid saturation or cutoff.
  3. Power Dissipation:

    • Calculate the power dissipation (PD) using the formula PD = VCE * IC.
    • Ensure that the power dissipation does not exceed the maximum rating of 300 mW to prevent thermal damage.
  4. Handling:

    • Handle the transistor with care to avoid static discharge which can damage the device.
    • Use anti-static wrist straps and mats when handling sensitive components.
  5. Testing:

    • Test the transistor using a multimeter or a transistor tester to verify its parameters such as hFE, VCE, and IC.
    • Ensure the test conditions match the typical operating conditions specified in the datasheet.
  6. Storage:

    • Store the transistor in a dry, cool place away from direct sunlight and moisture.
    • Keep the device in its original packaging until ready for use to protect it from static and physical damage.
  7. Soldering:

    • Use a temperature-controlled soldering iron set to a maximum of 300°C (572°F) to avoid thermal shock.
    • Solder each lead quickly and avoid prolonged heating of the transistor.
  8. Circuit Design:

    • Design the circuit to include necessary protection components such as diodes for flyback voltage in switching applications.
    • Ensure the circuit layout minimizes parasitic inductance and capacitance to maintain stability and performance.
(For reference only)

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