Instructions:

1. Handling:

   • Handle with care to avoid mechanical stress.
   • Use appropriate ESD (Electrostatic Discharge) protection measures.

2. Mounting:

   • Ensure the PCB is clean and free from contaminants.
   • Apply solder paste evenly on the pads.
   • Place the capacitor accurately on the designated pads.
   • Use a reflow soldering process suitable for the termination type (Tin/Lead or Tin).

3. Soldering:

   • Preheat the board to the recommended temperature.
   • Reflow soldering profile should include a preheat, soak, and reflow stage.
   • Ensure the peak temperature is within the range specified by the solder paste manufacturer.
   • Allow the board to cool naturally after soldering.

4. Inspection:

   • Visually inspect the solder joints for proper wetting and alignment.
   • Use an automated optical inspection (AOI) system if available.

5. Testing:

   • Perform electrical testing to verify capacitance and voltage ratings.
   • Check for any shorts or opens.

6. Storage:

   • Store in a dry, cool place away from direct sunlight.
   • Follow the storage guidelines provided by the manufacturer to ensure long-term reliability.