Below is the parameter table and instructions for the SSC3S927L, a 3A Synchronous Buck Converter.

Parameter Table

Instructions

1. Pin Configuration

• VIN: Input voltage.
• VOUT: Output voltage.
• GND: Ground.
• FB: Feedback pin for output voltage adjustment.
• EN/UVLO: Enable/Under-Voltage Lockout.
• PG: Power Good indicator.
• BST: Bootstrap capacitor connection.
• SS/TRK: Soft-start/Tracking pin.
• NC: No Connect.
• EXPOS: Exposed pad for thermal dissipation.

2. Output Voltage Adjustment

• The output voltage can be adjusted using an external resistor divider connected to the FB pin.
• Use the formula: ( V_ = V_ times left(1 + fracright) )
  • ( V_ ) is typically 0.8V.
  • Choose R1 and R2 to set the desired output voltage.

3. Switching Frequency Setting

• The switching frequency can be set using an external resistor connected to the FREQ pin.
• Use the formula: ( f_ = frac{1.25 times 10^6} )
  • ( R_ ) is the resistance in ohms.

4. Enable/UVLO Function

• The EN/UVLO pin controls the enable function and under-voltage lockout.
• Apply a high logic level (≥1.2V) to enable the converter.
• The UVLO threshold is typically 2.3V.

5. Power Good Indicator

• The PG pin indicates when the output voltage is within the regulation range.
• It outputs a high logic level when VOUT is within ±10% of the set point.

6. Soft-Start and Tracking

• The SS/TRK pin controls the soft-start time and can be used for tracking other power supplies.
• Connect a capacitor from SS/TRK to GND to set the soft-start time.

7. Thermal Management

• Ensure proper heat dissipation by soldering the exposed pad (EXPOS) to a large ground plane on the PCB.
• Use a heatsink if necessary, especially at high output currents.

8. Capacitor Selection

• Input Capacitor (CIN): Use a ceramic capacitor with low ESR, typically 10μF to 22μF.
• Output Capacitor (COUT): Use a ceramic or tantalum capacitor, typically 10μF to 22μF.
• Bootstrap Capacitor (CBST): Use a ceramic capacitor, typically 0.1μF.

9. Layout Considerations

• Keep the input and output capacitors close to the IC.
• Minimize trace lengths for high-frequency signals (e.g., SW node).
• Use wide traces for power paths to reduce resistance and inductance.

10. Storage and Handling

• Store the device in a dry environment to prevent moisture damage.
• Handle with care to avoid static discharge and mechanical damage.

For detailed application circuits and more advanced configurations, refer to the datasheet provided by the manufacturer.