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Specifications
SKU: 12606376
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions |
|---|---|---|---|---|---|---|
| Drain-Source Voltage | VDS | - | 60 | - | V | |
| Gate-Source Voltage | VGS | -15 | - | 15 | V | |
| Continuous Drain Current | ID | - | 30 | - | A | TC = 25°C |
| Pulse Drain Current | IDpeak | - | 80 | - | A | tp = 10 μs, IG = 5 A |
| Total Power Dissipation | PTOT | - | - | 120 | W | TC = 25°C |
| Junction Temperature | TJ | - | - | 175 | °C | |
| Storage Temperature Range | TSTG | -55 | - | 150 | °C | |
| Thermal Resistance, Junction to Case | RθJC | - | 1.2 | - | °C/W | |
| Gate Charge | QG | - | 24 | - | nC | |
| Input Capacitance | Ciss | - | 1480 | - | pF | VDS = 25 V, f = 1 MHz |
| Output Capacitance | Coss | - | 180 | - | pF | VDS = 25 V, f = 1 MHz |
| Reverse Transfer Capacitance | Crss | - | 180 | - | pF | VDS = 25 V, f = 1 MHz |
Instructions for Use:
Handling Precautions:
- Handle the device with care to avoid damage.
- Use proper ESD (Electrostatic Discharge) protection measures.
Mounting:
- Ensure proper heat sinking to maintain the junction temperature within safe limits.
- Use thermal paste or thermal interface materials to enhance heat dissipation.
Biasing:
- Apply the gate-source voltage (VGS) within the specified range to avoid damage.
- Ensure the drain-source voltage (VDS) does not exceed the maximum rating.
Current Handling:
- Do not exceed the continuous drain current (ID) at the specified case temperature.
- For pulse applications, ensure the pulse duration and current do not exceed the maximum ratings.
Thermal Management:
- Monitor the junction temperature (TJ) to prevent overheating.
- Use appropriate cooling methods such as forced air or liquid cooling if necessary.
Storage:
- Store the device in a dry, cool place within the specified storage temperature range.
Testing:
- Perform all tests under controlled conditions to ensure accurate results.
- Use the specified test conditions for input and output capacitance measurements.
Soldering:
- Follow recommended soldering profiles to avoid thermal shock and damage to the device.
- Allow sufficient time for the device to cool down after soldering before testing.
Documentation:
- Refer to the datasheet for detailed electrical characteristics and mechanical dimensions.
- Consult application notes for specific circuit design recommendations.
Inquiry - FGH30N6S2
