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IRS20955S

Specifications

SKU: 12607095

BUY IRS20955S https://www.utsource.net/itm/p/12607095.html

Parameter Symbol Test Conditions Min Typ Max Unit
Supply Voltage VCC - 10 - 20 V
Gate Drive Output Voltage (High Side) VGH IL = 1 A, TA = 25°C 13.5 - 16.5 V
Gate Drive Output Voltage (Low Side) V<sub.GL IL = 1 A, TA = 25°C 13.5 - 16.5 V
High-Side Driver Supply Current IHSD VCC = 15 V, TA = 25°C - 50 100 μA
Low-Side Driver Supply Current ILSD VCC = 15 V, TA = 25°C - 50 100 μA
Maximum Continuous Output Current (High Side) IOH VCC = 15 V, TA = 25°C - 4 6 A
Maximum Continuous Output Current (Low Side) IOL VCC = 15 V, TA = 25°C - 4 6 A
Propagation Delay Time (High to Low) tdHL VCC = 15 V, TA = 25°C, RG = 4.7 Ω - 80 120 ns
Propagation Delay Time (Low to High) tdLH VCC = 15 V, TA = 25°C, RG = 4.7 Ω - 80 120 ns
Dead Time tdead VCC = 15 V, TA = 25°C 40 - 60 ns
Operating Temperature Range TOP - -40 - 125 °C

Instructions for Use:

  1. Supply Voltage (VCC):

    • Ensure the supply voltage is within the range of 10 V to 20 V to avoid damage to the device.
  2. Gate Drive Output Voltage:

    • The high-side and low-side gate drive output voltages should be between 13.5 V and 16.5 V under typical operating conditions.
  3. Driver Supply Current:

    • The high-side and low-side driver supply currents should not exceed 100 μA at a supply voltage of 15 V and ambient temperature of 25°C.
  4. Maximum Continuous Output Current:

    • The maximum continuous output current for both high-side and low-side drivers is 6 A. Ensure that the load does not exceed this limit.
  5. Propagation Delay Time:

    • The propagation delay times from high to low and low to high should be within 80 ns to 120 ns under standard test conditions.
  6. Dead Time:

    • The dead time between the high-side and low-side outputs should be between 40 ns and 60 ns to prevent shoot-through.
  7. Operating Temperature Range:

    • The device is designed to operate within a temperature range of -40°C to 125°C. Ensure that the ambient temperature stays within these limits to avoid thermal stress.
  8. Layout Considerations:

    • Use short and wide traces for the power paths to minimize inductance and reduce noise.
    • Place decoupling capacitors close to the VCC and GND pins to ensure stable operation.
  9. ESD Protection:

    • Handle the device with care to avoid electrostatic discharge (ESD) damage. Use ESD-safe tools and work surfaces.
  10. Storage and Handling:

    • Store the device in a dry, cool place away from direct sunlight and moisture.
    • Follow proper handling procedures to prevent mechanical damage.

For more detailed information, refer to the datasheet provided by the manufacturer.

(For reference only)

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