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HEF4044

Specifications

SKU: 12607247

BUY HEF4044 https://www.utsource.net/itm/p/12607247.html

Parameter Symbol Min Typ Max Unit Conditions
Supply Voltage VDD 3 - 15 V -
Input Low Voltage VIL - - 0.8 V VDD = 5V
Input High Voltage VIH 2.0 - - V VDD = 5V
Output Low Voltage VOL 0.4 0.5 0.6 V IOL = 0.4mA, VDD = 5V
Output High Voltage VOH 2.7 3.5 4.5 V IOH = -0.4mA, VDD = 5V
Input Leakage Current IIL -1 - 1 μA VDD = 0 to 15V
Output Leakage Current IOL -1 - 1 μA VDD = 0 to 15V
Propagation Delay Time tpd 12 - 36 ns VDD = 5V, fL = 1kHz, CL = 15pF
Power Dissipation PD - - 100 mW Per Package
Operating Temperature Range TA -40 - 85 °C -

Instructions for Use:

  1. Power Supply:

    • The HEF4044 can operate with a supply voltage (VDD) ranging from 3V to 15V.
    • Ensure that the power supply is stable and within the specified range to avoid damage to the device.
  2. Input Levels:

    • For reliable operation, input voltages should be kept within the specified limits.
    • Input low voltage (VIL) should not exceed 0.8V when VDD is 5V.
    • Input high voltage (VIH) should be at least 2.0V when VDD is 5V.
  3. Output Levels:

    • Output low voltage (VOL) should be below 0.6V when sourcing 0.4mA and VDD is 5V.
    • Output high voltage (VOH) should be above 2.7V when sinking -0.4mA and VDD is 5V.
  4. Leakage Current:

    • Both input and output leakage currents should be kept within ±1μA to ensure proper operation.
  5. Propagation Delay:

    • The propagation delay time (tpd) is typically between 12ns and 36ns under standard conditions (VDD = 5V, fL = 1kHz, CL = 15pF).
  6. Power Dissipation:

    • The maximum power dissipation per package is 100mW. Ensure adequate heat dissipation if operating near this limit.
  7. Operating Temperature:

    • The device can operate over a temperature range from -40°C to 85°C. Ensure that the ambient temperature does not exceed these limits to prevent thermal damage.
  8. Handling:

    • Handle the device with care to avoid static discharge, which can damage the internal circuits.
    • Use appropriate ESD protection measures during handling and installation.
  9. Storage:

    • Store the device in a dry, cool place away from direct sunlight and sources of heat.
  10. Soldering:

    • Use a soldering iron with a temperature not exceeding 300°C and complete the soldering process quickly to avoid thermal stress on the device.
(For reference only)

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