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F30S60S

Specifications

SKU: 12608227

BUY F30S60S https://www.utsource.net/itm/p/12608227.html

Parameter Symbol Min Typical Max Unit
Breakdown Voltage V(BR)DSS - 600 - V
Continuous Drain Current (Tc = 25°C) ID - 30 - A
Continuous Drain Current (Tc = 100°C) ID - 20 - A
Gate-Source Voltage VGS -15 0 15 V
Drain-Source On-State Resistance (VGS = 10V, ID = 30A) RDS(on) - 0.025 - Ω
Total Power Dissipation (Tc = 25°C) PD - 180 - W
Junction Temperature TJ -55 - 175 °C
Storage Temperature Range TSTG -55 - 150 °C
Maximum Operating Junction Temperature Tjmax - 175 - °C

Instructions for Using F30S60S:

  1. Mounting and Handling:

    • Ensure proper heat sinking to maintain the junction temperature within safe limits.
    • Handle with care to avoid static discharge, which can damage the device.
  2. Operating Conditions:

    • Do not exceed the maximum ratings specified in the table.
    • Ensure the gate-source voltage (VGS) is within the specified range to prevent damage or malfunction.
  3. Thermal Management:

    • Use appropriate thermal management techniques to keep the junction temperature below 175°C.
    • Consider the continuous drain current ratings at different temperatures to ensure safe operation.
  4. Storage:

    • Store the device in a dry, cool environment within the storage temperature range (-55°C to 150°C).
  5. Testing and Measurement:

    • Use suitable test equipment to measure parameters such as drain-source on-state resistance (RDS(on)) and breakdown voltage (V(BR)DSS).
    • Follow standard testing procedures to avoid damaging the device.
  6. Circuit Design:

    • Design circuits to handle the maximum power dissipation (PD) and ensure adequate cooling.
    • Use appropriate gate drive circuits to control the MOSFET effectively.
  7. Safety Precautions:

    • Always use protective equipment when handling high-voltage components.
    • Follow all safety guidelines to prevent electrical shock and other hazards.

By adhering to these instructions, you can ensure reliable and efficient operation of the F30S60S MOSFET.

(For reference only)

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