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TC74ACT299P

Specifications

SKU: 12609621

BUY TC74ACT299P https://www.utsource.net/itm/p/12609621.html

Parameter Symbol Conditions Min Typ Max Unit
Supply Voltage VCC Operating 2.0 - 5.5 V
Input Voltage VI Input Low 0 - 0.8 V
Input Voltage VI Input High 2.0 - VCC V
Output Voltage VO Output Low 0 - 0.4 V
Output Voltage VO Output High 2.4 - VCC - 0.1 V
Input Current II Input Low -1 - 1 μA
Input Current II Input High -1 - 1 μA
Output Current IO Output Low - - 8 mA
Output Current IO Output High - - -8 mA
Propagation Delay tpd VCC = 5V, TA = 25°C 6 - - ns
Power Dissipation PD Continuous - - 350 mW
Operating Temperature TA - -40 - 85 °C
Storage Temperature TSTG - -65 - 150 °C

Instructions for Use:

  1. Power Supply:

    • Ensure the supply voltage (VCC) is within the range of 2.0V to 5.5V.
    • Connect the ground (GND) pin to a stable ground reference.
  2. Input Signals:

    • For input low, ensure the input voltage (VI) is between 0V and 0.8V.
    • For input high, ensure the input voltage (VI) is between 2.0V and VCC.
  3. Output Signals:

    • For output low, the output voltage (VO) will be between 0V and 0.4V.
    • For output high, the output voltage (VO) will be between 2.4V and VCC - 0.1V.
  4. Current Ratings:

    • The maximum input current (II) should not exceed ±1μA.
    • The maximum output current (IO) should not exceed ±8mA.
  5. Propagation Delay:

    • At VCC = 5V and ambient temperature (TA) = 25°C, the propagation delay (tpd) is typically 6ns.
  6. Thermal Considerations:

    • The device can operate at temperatures ranging from -40°C to 85°C.
    • Store the device in an environment with temperatures between -65°C and 150°C.
  7. Power Dissipation:

    • The maximum power dissipation (PD) is 350mW. Ensure proper heat sinking if operating near this limit.
  8. Handling:

    • Handle the device with care to avoid static discharge and physical damage.
    • Follow standard ESD precautions when handling and soldering the device.
(For reference only)

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