Instructions for Use:

1. Mounting and Handling:

   • Handle the device with care to avoid mechanical stress.
   • Ensure proper mounting on a heatsink if operating at high power levels to maintain junction temperature within safe limits.

2. Electrical Connections:

   • Connect the drain (D) to the load or power supply.
   • Connect the source (S) to the ground or return path.
   • Apply the gate-source voltage (VGS) to control the device.

3. Operating Conditions:

   • Do not exceed the maximum ratings listed in the table.
   • Ensure the gate-source voltage (VGS) is within the specified range to prevent damage.
   • Keep the junction temperature (Tj) below 150°C to avoid thermal runaway.

4. Pulse Operation:

   • For pulse applications, ensure the peak pulse current (Ipp) does not exceed 32A for pulse durations up to 100 μs.

5. Storage:

   • Store the device in a dry, cool place within the storage temperature range (-65°C to 150°C).

6. Testing:

   • When testing the device, use appropriate test equipment and follow safety guidelines to avoid damage to the device or injury.

7. Derating:

   • Derate the continuous drain current (ID) and power dissipation (PD) as per the derating curve provided in the datasheet for operation at higher temperatures.

8. Soldering:

   • Follow recommended soldering profiles to avoid thermal shock and damage to the device.