Instructions for Use:

1. Mounting and Handling:

   • Handle the device with care to avoid mechanical stress.
   • Ensure proper heat sinking if operating at high currents or power dissipation.

2. Electrical Connections:

   • Connect the drain (D) and source (S) terminals correctly to avoid damage.
   • The gate (G) terminal should be connected with a low-inductance path to minimize noise and parasitic oscillations.

3. Biasing and Operation:

   • Apply the gate-source voltage (V_GS) within the specified limits to ensure reliable operation.
   • Monitor the drain-source voltage (V_DS) to prevent exceeding the maximum rating.

4. Thermal Management:

   • Ensure adequate cooling to keep the junction temperature (T_J) below the maximum limit.
   • Use a heatsink if necessary, especially for continuous high-power applications.

5. Storage and Environment:

   • Store the device in a dry, cool place to prevent moisture damage.
   • Avoid exposing the device to temperatures outside the storage temperature range (T_STG).

6. Testing and Troubleshooting:

   • Test the device under controlled conditions to verify its performance.
   • If issues arise, check for proper connections, correct biasing, and thermal management.