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MPC555LF8MZP40

Specifications

SKU: 12614399

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Parameter Description Value
Device Microcontroller MPC555LF8MZP40
Architecture CPU Power Architecture
Core 32-bit e200z6 core
Clock Speed Maximum operating frequency 100 MHz
Flash Memory Program memory 512 KB
RAM Data memory 64 KB
EEPROM Non-volatile data storage 4 KB
Package Package type LQFP-144
Operating Voltage Supply voltage range 3.0 V to 3.6 V
Temperature Range Operating temperature range -40°C to 125°C
Analog-to-Digital Converter (ADC) Number of ADC channels 16
Digital-to-Analog Converter (DAC) Number of DAC channels 2
Timers Number of timers 6
Communication Interfaces Supported communication interfaces SPI, I2C, UART, CAN
GPIO General-purpose input/output pins 112
Watchdog Timer Watchdog timer Yes
Power Management Low-power modes Sleep, Doze, Stop
Interrupts Number of interrupt lines 64
Debug Interface Debug interface JTAG, BDM
Capacitance Input capacitance 10 pF
Current Consumption Active mode current consumption 10 mA (typical)
Standby Current Standby mode current consumption 1 μA (typical)

Instructions for Use:

  1. Power Supply:

    • Ensure the supply voltage is within the specified range (3.0 V to 3.6 V).
    • Use decoupling capacitors (0.1 μF and 10 μF) close to the power pins to stabilize the power supply.
  2. Clock Configuration:

    • Configure the internal or external clock source as per the application requirements.
    • Set the clock prescaler and divider values to achieve the desired system clock frequency.
  3. Flash Programming:

    • Use the provided development tools and software (e.g., CodeWarrior) to program the flash memory.
    • Follow the programming guidelines to ensure reliable and secure code loading.
  4. Peripheral Initialization:

    • Initialize the required peripherals (ADC, DAC, timers, communication interfaces) using the appropriate register settings.
    • Refer to the device datasheet for specific register configurations.
  5. GPIO Configuration:

    • Configure the GPIO pins for input, output, or alternate functions as needed.
    • Set the pull-up/pull-down resistors and drive strength according to the application requirements.
  6. Interrupt Handling:

    • Enable and configure the necessary interrupts in the interrupt controller.
    • Write interrupt service routines (ISRs) to handle the interrupt events.
  7. Power Management:

    • Utilize the low-power modes (Sleep, Doze, Stop) to reduce power consumption during idle periods.
    • Ensure proper wake-up sources are configured to exit from low-power modes.
  8. Debugging:

    • Connect the JTAG or BDM interface to the debugger for debugging and programming.
    • Use the debugging tools to set breakpoints, inspect variables, and step through the code.
  9. Thermal Management:

    • Ensure adequate heat dissipation by following the recommended PCB layout guidelines.
    • Monitor the device temperature and use heatsinks if necessary.
  10. Electrostatic Discharge (ESD) Protection:

    • Handle the device with ESD precautions to avoid damage.
    • Use anti-static wrist straps and mats when handling the device.

For detailed information, refer to the device datasheet and user manual.

(For reference only)

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